The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jun. 22, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yann Mignot, Slingerlands, NY (US);

Chanro Park, Clifton Park, NY (US);

Hsueh-Chung Chen, Cohoes, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 23/5329 (2013.01); H01L 21/0337 (2013.01); H01L 21/7682 (2013.01);
Abstract

A top cap layer covering a first metal line and a second metal line, horizontally between the first metal line and the second metal line is, in sequential order, a post cap liner, an air gap and the post cap liner. A first set of metal lines embedded in an upper surface of a dielectric, a second set of metal lines embedded below the dielectric and above the electronic components, a post cap liner covering the first set of metal lines, a cavity which dissects a first metal line of the first set of metal lines and extends to a second metal line of the second set of metal lines and dissects the second set of metal lines. Forming a cavity in a first metal line embedded in an upper surface of a dielectric, where the first metal line and the dielectric are covered by a top cap layer.


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