The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Sep. 22, 2021
International Business Machines Corporation, Armonk, NY (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Yann Mignot, Slingerlands, NY (US);
Mary Claire Silvestre, Clifton Park, NY (US);
Effendi Leobandung, Stormville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A redistribution layer for an integrated circuit package is provided. The redistribution layer includes a first conductive layer and a second layer disposed directly on the first conductive layer. The first conductive layer has a resistivity of less than 3.6*10Ω·m and has a thickness of greater than or equal to 1 μm. The second layer includes tungsten. An integrated circuit package is also provided that includes the redistribution layer electrically connecting a first integrated circuit of the first integrated circuit package to a first input/output of a frame of the integrated circuit package. The frame is connected to the first integrated circuit. A method for manufacturing a redistribution layer is also provided.