The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jun. 10, 2021
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Ai-Wen Wang, Taichung, TW;

Wei-Chun Shen, Taichung, TW;

Yu-Mei Chen, Taichung, TW;

Guiyang Jiang, Shanghai, CN;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 17/065 (2006.01); H01C 17/28 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10B 41/35 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H01C 17/281 (2013.01); H01C 17/065 (2013.01); H01L 24/01 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H10B 41/35 (2023.02); H10B 43/35 (2023.02); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A data storage device includes a substrate including a number of contact pads and a number of passive component packages coupled to the contact pads. The data storage device further includes a memory controller coupled to the substrate, and one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller. One or more of the passive component packages include a first passive component, a second passive component electrically connected to the first passive component, and a first terminal coupled to the first passive component. The passive component packages further include a second terminal coupled to the second passive component, and a third terminal coupled to a common node of the first passive component and the second passive component.


Find Patent Forward Citations

Loading…