The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Aug. 01, 2023
Applicant:

Panduit Corp., Tinley Park, IL (US);

Inventors:

Royal O. Jenner, Frankfort, IL (US);

Timothy J. Houghton, II, Chicago, IL (US);

Masud Bolouri-Saransar, Orland Park, IL (US);

Ronald A. Nordin, Naperville, IL (US);

Assignee:

Panduit Corp., Tinley Park, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 11/08 (2006.01); B23K 26/08 (2014.01); B23K 26/18 (2006.01); B23K 26/40 (2014.01); H01B 11/02 (2006.01); H01B 11/10 (2006.01); H01B 13/26 (2006.01); B23K 103/16 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01B 11/085 (2013.01); B23K 26/0846 (2013.01); B23K 26/18 (2013.01); B23K 26/40 (2013.01); H01B 11/02 (2013.01); H01B 11/08 (2013.01); H01B 11/1008 (2013.01); H01B 11/1025 (2013.01); H01B 13/26 (2013.01); B23K 2103/172 (2018.08); H05K 1/0224 (2013.01); H05K 3/027 (2013.01); Y10T 29/49194 (2015.01);
Abstract

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.


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