The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jan. 16, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Taeyoung Oh, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/4097 (2006.01); G11C 7/10 (2006.01); G11C 11/4076 (2006.01); G11C 11/4093 (2006.01); H01L 23/48 (2006.01); H03K 19/0175 (2006.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
G11C 11/4093 (2013.01); G11C 7/1051 (2013.01); G11C 7/109 (2013.01); G11C 11/4076 (2013.01); H01L 23/481 (2013.01); H03K 19/0175 (2013.01); H10B 80/00 (2023.02);
Abstract
A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.