The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Nov. 06, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hideki Ueda, Fukui, JP;

Yusuke Nakamura, Hyogo, JP;

Koichiro Nakashima, Fukui, JP;

Takashi Uchida, Osaka, JP;

Toshio Yamazaki, Fukui, JP;

Hiroyuki Fujii, Fukui, JP;

Chikara Nara, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/5783 (2012.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5783 (2013.01); B81B 7/0048 (2013.01); B81B 7/0074 (2013.01); B81B 2201/0242 (2013.01); B81B 2207/012 (2013.01);
Abstract

A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.


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