The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 29, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yoko Nakai, Nagano, JP;

Hideki Tanaka, Nagano, JP;

Shinobu Yokokawa, Nagano, JP;

Shunichi Seki, Nagano, JP;

Naotaka Higuchi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21B 1/32 (2006.01); D21B 1/08 (2006.01); D21G 9/00 (2006.01);
U.S. Cl.
CPC ...
D21B 1/32 (2013.01); D21B 1/08 (2013.01); D21G 9/0018 (2013.01);
Abstract

A fiber body manufacturing method includes: a dispersing step of dispersing a mixture containing a defibrated material which includes fibers and a binding agent which exhibits a binding property by moisture absorption, the mixture having a moisture content of 10 to 30 percent by weight; a depositing step of depositing the mixture dispersed in the dispersing step; a humidifying step of imparting moisture by water vapor or mist to the binding agent in a deposit deposited in the depositing step so as to exhibit the binding property; and a forming step of forming the deposit humidified in the humidifying step into a fiber body.


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