The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Oct. 27, 2023
Applicants:
Tokyo Metropolitan Public University Corporation, Tokyo, JP;
National University Corporation Hokkaido University, Sapporo, JP;
Inventors:
Assignees:
TOKYO METROPOLITAN PUBLIC UNIVERSITY CORPORATION, Tokyo, JP;
NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY, Sapporo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 19/05 (2006.01); B22F 1/00 (2022.01); B33Y 70/00 (2020.01); C22C 1/04 (2023.01); C22F 1/10 (2006.01);
U.S. Cl.
CPC ...
C22C 1/0433 (2013.01); B22F 1/00 (2013.01); B33Y 70/00 (2014.12); C22C 19/056 (2013.01); C22F 1/10 (2013.01);
Abstract
A heat-resistant alloy contains Y, a content of Ni is a content of Ni is 58.0 mass % or greater, a content of Cr is 20.0 mass % or greater and 23.0 mass % or less, a content of Mo is 8.0 mass % or greater and 10.0 mass % or less, a content of Nb is 3.15 mass % or greater and 4.15 mass % or less, a content of O is 0.002 mass % or greater and 0.1 mass % or less, and a ratio of a content of Y in terms of mass to a content of O in terms of mass is 0.5 or greater and 100 or less.