The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Oct. 07, 2020
Applicant:
Oji Holdings Corporation, Tokyo, JP;
Inventors:
Assignee:
OJI HOLDINGS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 25/06 (2006.01); C08J 5/18 (2006.01); H01G 4/06 (2006.01); H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
C08L 25/06 (2013.01); C08J 5/18 (2013.01); H01G 4/06 (2013.01); C08J 2325/06 (2013.01); C08J 2453/02 (2013.01); C08J 2471/12 (2013.01); C08L 2205/03 (2013.01); H01G 4/32 (2013.01);
Abstract
Provided is a technique of obtaining films with higher dielectric breakdown strength at high temperatures and folding resistance. A resin composition comprises (1) a syndiotactic polystyrene resin, (2) a polyphenylene ether resin, and (3) at least one member selected from the group consisting of styrene-based thermoplastic elastomers and atactic polystyrene resins, wherein the content of the polyphenylene ether resin in the resin composition is 6 mass % or more.