The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 09, 2022
Applicant:

Yupo Corporation, Tokyo, JP;

Inventor:

Ryo Sato, Ibaraki, JP;

Assignee:

YUPO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 7/04 (2020.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); C09D 5/00 (2006.01); C09D 123/22 (2006.01); C09D 135/02 (2006.01);
U.S. Cl.
CPC ...
C08J 7/0427 (2020.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/32 (2013.01); C09D 5/008 (2013.01); C09D 123/22 (2013.01); C09D 135/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/242 (2013.01); B32B 2250/40 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/104 (2013.01); B32B 2270/00 (2013.01); B32B 2307/516 (2013.01); B32B 2307/538 (2013.01); B32B 2307/554 (2013.01); C08J 2323/12 (2013.01); C08J 2423/22 (2013.01); C08J 2425/14 (2013.01); C08J 2435/02 (2013.01); C08J 2475/04 (2013.01);
Abstract

The present invention provides a layered product comprising a release layer that can be formed from an aqueous coating liquid, that is quickly released from the substrate when alkaline treatment is performed, and that has excellent water resistance. The layered product of the present invention is a layered product comprising a release layer on a substrate, the release layer comprising a granular carboxylic anhydride-modified olefin resin and a binding part containing an acid group-free thermoplastic resin, the carboxylic anhydride-modified olefin resin having an average particle size of 0.5 to 20 μm, the binding part having a thickness of 0.25 to 20 μm, and the release layer having an actual acid value of 100 mg KOH/mor more.


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