The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Oct. 30, 2019
Pi Advanced Materials Co., Ltd., Chungcheongbuk-do, KR;
Ik Sang Lee, Gyeongsangbuk-do, KR;
Joo Young Kim, Sejong, KR;
Gyeong Hyeon Ro, Gyeongsangnam-do, KR;
PI Advanced Materials Co., Ltd., Chungcheongbuk-do, KR;
Abstract
The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon Oplasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile