The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Mar. 09, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/02 (2006.01); B29K 509/02 (2006.01);
U.S. Cl.
CPC ...
B29C 70/025 (2013.01); B29K 2509/02 (2013.01);
Abstract
The method for manufacturing a molded product of the present disclosure includes a deposition step of depositing a mixture including a fiber and a complex, a humidification step of humidifying the mixture, and a molding step of heating and pressurizing the humidified mixture to obtain a molded product. The complex includes a composite particle in which a binding material particle containing a binding material that exerts a binding force for binding the individual fibers together by being applied with moisture and an inorganic particle are included as a unit.