The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jun. 06, 2019
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Tadahiro Yabu, Osaka, JP;
Hiroyuki Sendan, Osaka, JP;
Tadaharu Isaka, Osaka, JP;
Ryouichi Fukagawa, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 48/92 (2019.01); B29B 7/42 (2006.01); B29B 7/48 (2006.01); B29B 7/58 (2006.01); B29B 7/72 (2006.01); B29C 48/04 (2019.01); B29C 48/37 (2019.01); B29K 27/00 (2006.01); B29K 27/18 (2006.01);
U.S. Cl.
CPC ...
B29C 48/92 (2019.02); B29B 7/428 (2013.01); B29B 7/488 (2013.01); B29B 7/582 (2013.01); B29B 7/726 (2013.01); B29B 7/728 (2013.01); B29C 48/04 (2019.02); B29C 48/37 (2019.02); B29C 2948/92514 (2019.02); B29C 2948/926 (2019.02); B29C 2948/92704 (2019.02); B29C 2948/92876 (2019.02); B29K 2027/16 (2013.01); B29K 2027/18 (2013.01);
Abstract
Provided is a method for producing a resin molded article, capable of reducing deterioration of resin during melt extrusion. The method includes passing a resin fed from a hopper for resin through a molding machine provided with the hopper, an extruder, and a pressure control device in this order, to produce a resin molded article, the resin pressure between a tip of the extruder and an inlet port for resin of the pressure control device being 15.0 MPa or lower.