The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Nov. 10, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hiroki Minowa, Matsumoto, JP;

Kazuhiko Tsuchimoto, Matsumoto, JP;

Takuya Higuchi, Yamagata, JP;

Yuji Saito, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); B29C 45/76 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7626 (2013.01); B29C 45/7686 (2013.01); G05B 19/4183 (2013.01); B29C 2045/7633 (2013.01); B29C 2945/76806 (2013.01); G05B 2219/2624 (2013.01);
Abstract

There is provided an injection molding machine management system including an injection molding machine configured to mold a molded article with injection molding, a peripheral device configured to perform a post-process of the injection molding, and a control device communicably coupled to the injection molding machine and the peripheral device. The injection molding machine management system includes a generating section configured to generate a common identifier for each of predetermined production units and transmit the common identifier to the peripheral device. Molding data concerning the injection molding and post-process data concerning the post-process are correlated with the common identifier.


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