The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 08, 2019
Applicants:

Origin Company, Limited, Saitama, JP;

Koki Company Limited, Tokyo, JP;

Inventors:

Arisa Shiraishi, Saitama, JP;

Naoto Ozawa, Saitama, JP;

Takayuki Suzuki, Saitama, JP;

Mitsuyasu Furusawa, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/26 (2006.01); B23K 35/362 (2006.01); C22C 13/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3615 (2013.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); C22C 13/00 (2013.01); B23K 2101/42 (2018.08);
Abstract

The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.


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