The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Sep. 16, 2022
Applicant:

Hewlett Packard Enterprise Development Lp, Spring, TX (US);

Inventors:

See Yun Yow, Singapore, SG;

Kah Hoe Ng, Singapore, SG;

Chien-Shuo Tang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01L 23/473 (2013.01); H02M 7/003 (2013.01); H05K 7/20281 (2013.01);
Abstract

Example implementations relate to an integrated circuit (IC) package, an electronic device having the IC package, and a method of assembling the IC package to a printed circuit board (PCB) of the electronic device. The IC package includes a substrate, a chip, and an electromagnetic shield. The chip is coupled to the substrate. The electromagnetic shield is coupled to the substrate such that the chip is enclosed between the substrate and the electromagnetic shield. The electromagnetic shield includes a ferromagnetic material. Further, the electromagnetic shield protrudes beyond the substrate and is electrically grounded to the PCB to prevent an electromagnetic interference (EMI) noise from radiating through the IC package.


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