The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Feb. 06, 2023
Sumitomo Electric Industries, Ltd., Osaka, JP;
Autonetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Yuta Miyagawa, Osaka, JP;
Chaoran Li, Yokkaichi, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
AUTONETWORKS TECHNOLOGIES, LTD., Yokkaichi, JP;
SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi, JP;
Abstract
A high-frequency circuit includes: a first ground layer having an electric conductor formed therein; a second ground layer having an electric conductor formed therein; and a conductive pattern layer having a first conductive pattern formed thereon. The first ground layer, the second ground layer, and the conductive pattern layer are laminated one on another. The conductive pattern layer includes a first area in which a distance to the electric conductor formed in the second ground layer is longer than a distance to the electric conductor formed in the first ground layer, in a lamination direction in which the first ground layer, the second ground layer, and the conductive pattern layer are laminated. At least a part of the first conductive pattern is disposed in the first area.