The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Jul. 26, 2017
Applicant:

Valeo Vision, Bobigny, FR;

Inventors:

Nicolas Lefaudex, Bobigny, FR;

Antoine De Lamberterie, Bobigny, FR;

Guillaume Thin, Bobigny, FR;

Samira Mbata, Bobigny, FR;

Thomas Canonne, Bobigny, FR;

Van Thai Hoang, Bobigny, FR;

Vincent Dubois, Bobigny, FR;

Francois-Xavier Amiel, Bobigny, FR;

Assignee:

VALEO VISION, Bobigny, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); F21S 43/14 (2018.01); F21S 43/19 (2018.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); F21S 43/14 (2018.01); F21S 43/195 (2018.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 24/94 (2013.01); H01L 27/156 (2013.01); H01L 25/167 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05647 (2013.01);
Abstract

A process for mounting a light component on a carrier. The light component includes a generally planar substrate, on a first face of which submillimetre-sized electroluminescent semiconductor elements are epitaxied in the form of a matrix. The process is noteworthy in that it eliminates the need for a layer of filler material between the component and the carrier, while providing good thermal and electrical conductivity between the component and the carrier and high mechanical strength.


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