The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
May. 22, 2020
Applicant:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventor:
Taku Horii, Osaka, JP;
Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 21/28 (2006.01); H01L 23/00 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/28017 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 29/42364 (2013.01); H01L 29/49 (2013.01); H01L 29/78 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/29099 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate, a gate insulator provided on a surface of the semiconductor substrate, a bonding film, including silicon or aluminum, provided on the gate insulator, and a gate pad layer provided above the bonding film, wherein the gate pad layer includes titanium in at least a region in contact with the bonding film.