The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Nov. 30, 2021
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Matthew Essar, Wylie, TX (US);

Curtis Miller, Wylie, TX (US);

Christopher Sanabria, Richardson, TX (US);

Zhunming Du, Plano, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/043 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); H01L 23/043 (2013.01); H01L 23/492 (2013.01); H01L 23/49822 (2013.01); H01L 23/642 (2013.01); H01L 23/66 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/83801 (2013.01);
Abstract

The disclosure is directed to an electronic package with an interposer between integrated circuit dies. At least one inner capacitor (e.g., single layer capacitor) is mounted to the interposer. The electronic package further includes an input passive circuit substrate and an output passive circuit substrate mechanically coupled to the metal base. Use of an interposer to be simultaneously solder attached with integrated circuit dies provides a configuration that improves linearity performance and/or wide video bandwidth of the electronic package (e.g., packages that use epoxy and laminate interposers). Further, such configuration facilitates efficient manufacturing of the electronic package at high volumes.


Find Patent Forward Citations

Loading…