The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Oct. 26, 2020
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Takayuki Shirasaki, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01);
Abstract

Provided is a lid of an electronic component-housing package. The lid includes a conductor layer and a dielectric layer. The conductor layer includes at least one opening and a first part surrounding the at least one opening. The dielectric layer includes a second part, a first dielectric layer, and a second dielectric layer. The second part is located in the at least one opening. The first dielectric layer lies on the top of the conductor layer. The second part lies on the underside of the conductor layer.


Find Patent Forward Citations

Shirasaki, Takayuki. (2024). Lid, electronic component-housing package, and electronic device (U.S. Patent No. 12136598). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12136598

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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