The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Aug. 20, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Tomohiro Maegawa, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A device () is formed on a main surface of a semiconductor substrate (). A passivation film () covers the main surface. A metallized pattern () is formed on the passivation film () and surrounds the device (). A sealing metal layer () is formed on the metallized pattern () and includes a corner portion () in a planar view. A lid () is bonded to the metallized pattern () with the sealing metal layer () interposed therebetween and vacuum-seals the device (). A dummy wiring () is softer than the metallized pattern (), is formed at least between an outer portion of the corner portion of the sealing metal layer () and the semiconductor substrate (), and does not electrically connected to the device ().