The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Nov. 07, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Do Young Jeong, Suwon-si, KR;

Jin Mo Ahn, Suwon-si, KR;

Ji Hong Jo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.


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