The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Nov. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Byungseon Hwang, Suwon-si, KR;

Deokhee Lee, Suwon-si, KR;

Sunggyu Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
G06F 1/1684 (2013.01); G06F 1/1616 (2013.01); G06F 1/1652 (2013.01); G06F 1/1656 (2013.01); G06F 1/1681 (2013.01); G06V 40/13 (2022.01);
Abstract

An electronic device is provided. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes a fingerprint recognition sensor, a protective layer covering the fingerprint recognition sensor, an adhesive member placed on the protective layer, and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.


Find Patent Forward Citations

Hwang, Byungseon. (2024). Electronic device comprising sensor module (U.S. Patent No. 12135590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12135590

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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