The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Jul. 21, 2021
Applicant:

R&d Circuits, South Plainfield, NJ (US);

Inventors:

Michael Caprio, Monroe Township, NJ (US);

Dwarkesh Patel, Piscataway, NJ (US);

Hiren Patel, Hillsborough, NJ (US);

Yubing Wang, Pennington, NJ (US);

Donald Eric Thompson, Fremont, CA (US);

Assignee:

R&D Circuits, South Plainfield, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2805 (2013.01); G01R 31/2812 (2013.01); H05K 3/0047 (2013.01); H05K 3/429 (2013.01); H05K 1/0268 (2013.01); H05K 1/115 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/163 (2013.01);
Abstract

The present invention provides a method for detecting and adjusting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. This is accomplished, by after detecting poor back drills in a PCB, measuring the actual thickness of each PCB board. Next, the measured actual thickness of each PCB board is compared with .the theoretical thickness of each PCB board. The back drill depth for each area of the PCB board is then adjusted for its theoretical thickness and percent variation from the measured thickness to adjust the poor back drill.


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