The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Jun. 07, 2021
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventor:
Ai Takamori, Osaka, JP;
Assignee:
Henkel AG & CO. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 5/01 (2006.01); C08L 23/16 (2006.01); C08L 91/06 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 5/01 (2013.01); C08L 23/16 (2013.01); C08L 91/06 (2013.01); C08L 2205/03 (2013.01); C08L 2314/06 (2013.01); C09J 2301/304 (2020.08); C09J 2423/16 (2013.01); C09J 2491/00 (2013.01);
Abstract
Objective of the invention is to provide a hot-melt adhesive excellent in thermal resistance, good in adhesiveness over a wide range from low temperature to high temperature, and also excellent in thermal stability. Means for solving the problem is a hot-melt adhesive comprising an olefin copolymer (A), a tackifying resin (B) and a wax (C), wherein the olefin copolymer (A) comprises a metallocene-type ethylene/α-olefin copolymer (A1) having a melting point of 100 to 140° C.
Takamori, Ai. (2024). Hot-melt adhesive (U.S. Patent No. 12134719). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12134719
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile