The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Dec. 28, 2020
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Ryosuke Yamazaki, Ichihara, JP;

Kouichi Ozaki, Ichihara, JP;

Toru Imaizumi, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); B32B 25/20 (2006.01); C08J 5/18 (2006.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 7/40 (2018.01); C09J 183/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 25/20 (2013.01); C08J 5/18 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 7/40 (2018.01); C09J 183/04 (2013.01); B32B 2305/72 (2013.01); B32B 2307/732 (2013.01); B32B 2457/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 2383/07 (2013.01); C08J 2483/07 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C09J 2483/00 (2013.01); H01L 23/293 (2013.01);
Abstract

A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.


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