The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

May. 27, 2022
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventors:

Tse-Hung Liu, Taoyuan, TW;

Chia-Hung Wu, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08G 73/10 (2006.01); C08J 5/24 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1042 (2013.01); C08J 5/24 (2013.01); C08L 71/12 (2013.01); H05K 3/386 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A resin composition includes 10 parts by weight of a first prepolymer and 5 parts by weight to 30 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein the first prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, and the reaction mixture including a polyphenylmethane maleimide, a compound of Formula (1) and a compound of Formula (2) at a weight ratio of 100:10-30:15-45, and the resin composition is absent of a second prepolymer which is prepared by subjecting a maleimide and bis(trifluoromethyl)benzidine to a prepolymerization reaction. An article made from the resin composition may achieve improvement in at least one of the properties including ratio of electroless copper plating, storage modulus and copper foil peeling strength.


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