The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

May. 03, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Sun Ho Lee, Hwaseong-si, KR;

Jin Soo Shin, Suwon-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 23/03 (2006.01); B29C 43/52 (2006.01); C03B 11/12 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
C03B 23/0307 (2013.01); B29C 43/52 (2013.01); C03B 11/122 (2013.01); B29L 2007/00 (2013.01); C03B 2215/44 (2013.01); C03B 2215/50 (2013.01);
Abstract

An apparatus for processing cover windows includes a first mold including a first support a second support spaced apart from the first support, where the first support and second support are configured to hold processing targets; a second mold; and a third mold spaced apart from the second mold. The second mold includes a first pressurizing portion overlapping with the first support, having a first thickness, and a second pressurizing portion connected with the first pressurizing portion and configured to overlap with the first support, having a second thickness thinner than the first thickness. The third mold includes a third pressurizing portion overlapping with the second support, having a third thickness, and a fourth pressurizing portion connected with the third pressurizing portion and overlapping with the second support, having a fourth thickness thinner than the third thickness.


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