The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Aug. 23, 2023
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Chien-Hua Chen, Corvallis, OR (US);

Michael W. Cumbie, Corvallis, OR (US);

Michael G. Groh, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); B41J 2/18 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1639 (2013.01); B41J 2/14016 (2013.01); B41J 2/14201 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1625 (2013.01); B41J 2/18 (2013.01);
Abstract

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.


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