The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Jul. 06, 2021
Method and device for adhesively bonding substrates in film form and composite body obtained thereby
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Hans-Georg Kinzelmann, Pulheim, DE;
Michael Gierlings, Kaarst, DE;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 37/00 (2006.01); B32B 37/04 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/20 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 37/0053 (2013.01); B32B 37/04 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/203 (2013.01); B32B 2310/0825 (2013.01); B32B 2398/20 (2013.01);
Abstract
The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.