The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Oct. 13, 2021
Teijin Limited, Osaka, JP;
Daishiro Nakamoto, Osaka, JP;
Daisuke Noto, Osaka, JP;
Yuhei Konagai, Osaka, JP;
Ichiro Kitano, Osaka, JP;
Teijin Limited, Osaka, JP;
Abstract
Problems of high impact resistance and 'warpage' of a molded body are solved by a method for producing a molded body, including: using a mold MA and a mold MB, which are a pair of male and female molds, to compression-mold a material A and a material B in contact with the mold MA and the mold MB, respectively, in which the material A contains a carbon fiber and a thermoplastic resin M1, and the material B contains a glass fiber and a thermoplastic resin M2, the molded body includes a pair of side walls and a connecting wall that is connected to the side walls, the molded body has a wave shape in cross section, and a relationship between a flatness Fa of the molded body and a height h of the side wall satisfies 0≤Fa/h<1.3.