The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Nov. 15, 2019
Applicant:

Mgi Tech Co., Ltd., Shenzhen, CN;

Inventors:

Liang Wang, Newark, CA (US);

Cheng Frank Zhong, Menlo Park, CA (US);

Shifeng Li, Fremont, CA (US);

Assignee:

MGI Tech Co., Ltd., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); C09J 7/20 (2018.01); C09J 7/38 (2018.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); C09J 7/20 (2018.01); C09J 7/38 (2018.01); C09J 163/00 (2013.01); C09J 2203/326 (2013.01);
Abstract

A microfluidic apparatus () can include a PCB (), a biological chip () overlying the PCB (), and a microfluidic housing () overlying the biological chip () and the PCB (). The microfluidic apparatus () also has a first adhesive layer () attaching the microfluidic housing () to the biological chip () and a second adhesive layer () attaching the microfluidic housing () to the PCB (). The second adhesive layer () is thicker than the first adhesive layer (). The first adhesive layer () comprises a first adhesive material, and the second adhesive layer () comprises a second adhesive material.


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