The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

May. 06, 2020
Applicants:

Smith & Nephew, Inc., Memphis, TN (US);

University of Massachusetts, Boston, MA (US);

Inventors:

Philip David Canner, Cambridge, GB;

Raymond M. Dunn, Shrewsbury, MA (US);

John Alan Greenwood, West Yorkshire, GB;

Victoria Jody Hammond, Hull, GB;

Edward Yerbury Hartwell, Hull, GB;

John Kenneth Hicks, York, GB;

Elizabeth Mary Huddleston, York, GB;

Andrew Kelly, Hitchin, GB;

Andrew Linton, York, GB;

Marcus Damian Phillips, Grimsby, GB;

Mark Richardson, Grimsby, GB;

Carl Saxby, Brough, GB;

Tim Stern, Belper, GB;

Assignees:

Smith & Nephew, Inc., Memphis, TN (US);

University of Massachusetts, Boston, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 35/00 (2006.01); A61F 13/00 (2024.01); A61F 13/05 (2024.01); A61M 1/00 (2006.01); A61F 13/02 (2024.01); A61M 27/00 (2006.01);
U.S. Cl.
CPC ...
A61F 13/05 (2024.01); A61F 13/00995 (2013.01); A61M 1/915 (2021.05); A61M 1/916 (2021.05); A61F 2013/00357 (2013.01); A61M 1/913 (2021.05); A61M 1/96 (2021.05); A61M 1/985 (2021.05);
Abstract

The present invention relates to a negative pressure wound closure system and methods for using such a system. Preferred embodiments of the invention facilitate closure of the wound by preferentially contracting to provide for movement of the tissue. Preferred embodiments can utilize tissue securing portions that aid in securing the invention within a wound.


Find Patent Forward Citations

Loading…