The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Jun. 06, 2022
Applicant:

Irhythm Technologies, Inc., San Francisco, CA (US);

Inventors:

Jeffrey Joseph Abercrombie, II, Oakland, CA (US);

Genaro Sebastian Sepulveda, Oakland, CA (US);

Shena Hae Park, San Francisco, CA (US);

Ryan James Wensley, San Francisco, CA (US);

James Kihyun Lee, San Francisco, CA (US);

Thomas Burnell Reeve, III, San Francisco, CA (US);

Assignee:

iRhythm Technologies, Inc., San Francisco, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/05 (2021.01); A61B 5/257 (2021.01); A61B 5/282 (2021.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
A61B 5/257 (2021.01); A61B 5/282 (2021.01); A61B 5/6833 (2013.01); H05K 5/0026 (2013.01); H05K 5/0086 (2013.01); H05K 5/0226 (2013.01); H05K 7/1427 (2013.01); A61B 2562/0215 (2017.08); A61B 2562/0217 (2017.08); A61B 2562/166 (2013.01); A61B 2562/227 (2013.01);
Abstract

The present disclosure relates to a cardiac monitoring device and systems/methods relating to same. Preferred embodiments may include adhesive layers having channels for transpiring moisture to promote long term adhesion of the device to a subject. The adhesive layer may be surrounded by a non-adhesive lining to inhibit substrate layers from folding under the adhesive. In some embodiments, the adhesive layer may be replaceable. In some embodiments, the adhesive layer may extend beneath a substrate coupled to a housing but not be adhered to the overlying substrate layers. The angles of the edges of the adhesive layer may be configured to minimize peeling forces. Substrate layers above the adhesive layer may be perforated to promote transpiration of moisture and/or provide conformability to the substrate. The perforations may promote anisotropic resistance to compression and/or extension of the substrate.


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