The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jun. 23, 2022
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Andrew Benjamin Potter, Houston, TX (US);

John R. Grady, Cypress, TX (US);

Arthur G. Volkmann, Spring, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); G06F 1/20 (2013.01);
Abstract

An air baffle assembly for air cooling in computer systems is described. The air baffle assembly can include a baffle body removably installed on a printed circuit assembly deployed on a chassis. The baffle body can cover memory components. The air baffle assembly can also include an air dam removably installed on the baffle body. The baffle body has a slot positioned on a side of the baffle body, which can be substantially parallel to a wall of the chassis. The baffle body can further include alignment rails positioned in the slot to guide installation of the air dam into the slot. The installed air dam can reduce a bypass region, thereby reducing airflow through the bypass region and increasing airflow through the memory components.


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