The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Aug. 16, 2022
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Vincent Nguyen, Houston, TX (US);

Minh H. Nguyen, Katy, TX (US);

Kuan-Wei Chen, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); G01R 31/3185 (2006.01); G06F 1/18 (2006.01); G06F 9/4401 (2018.01); G06F 13/40 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1427 (2013.01);
Abstract

One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.


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