The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Jan. 17, 2020
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4626 (2013.01); C08F 2/50 (2013.01); C08G 73/1003 (2013.01); C08G 73/128 (2013.01); C08J 5/24 (2013.01); H05K 1/0366 (2013.01); H05K 1/09 (2013.01); C08J 2379/08 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0358 (2013.01);
Abstract
A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
Quick Actions:
Kumazawa, Yune. (2024). Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device (U.S. Patent No. 12133339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12133339
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile