The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
May. 11, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Tomoki Kato, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/0206 (2013.01); H05K 3/4644 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/1126 (2013.01);
Abstract
A circuit board having an insulating layer containing a low-temperature sintering ceramic material and wiring. The wiring includes a thermal via having an area of 0.0025 mmor more in top view thereof, the thermal via is a stack of layers of tapered conductors, each having tapered end faces, and each end face of the tapered conductors are in direct contact with the insulating layer.