The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Dec. 22, 2022
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;

Inventors:

Dan Li, Qingdao, CN;

Yifan Xie, Qingdao, CN;

Mengbo Fu, Qingdao, CN;

Qinhao Fu, Qingdao, CN;

Tengfei Wang, Qingdao, CN;

Feng Cui, Qingdao, CN;

Chuanbin Li, Qingdao, CN;

Zhanpeng Zhang, Qingdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/25 (2013.01); H04J 14/02 (2006.01); H04J 14/00 (2006.01);
U.S. Cl.
CPC ...
H04B 10/25 (2013.01); H04J 14/02 (2013.01);
Abstract

An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.


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