The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Sep. 13, 2018
Applicant:

Dr. Ing. H.c. F. Porsche Aktiengesellschaft, Stuttgart, DE;

Inventors:

Stefan Götz, Forstern, DE;

Malte Jaensch, Bietigheim-Bissingen, DE;

David Kuhn, Uhingen, DE;

Patrick Leidig, Stuttgart, DE;

Tim Schmidt, Freiberg am Neckar, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/42 (2006.01); B60L 50/64 (2019.01); B60L 58/26 (2019.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/647 (2014.01); H01M 10/6554 (2014.01); H01M 10/6556 (2014.01); H01M 10/667 (2014.01); H01M 50/20 (2021.01); H01M 50/209 (2021.01); H01M 50/211 (2021.01); H01M 50/213 (2021.01); H01M 50/284 (2021.01);
U.S. Cl.
CPC ...
H01M 10/647 (2015.04); B60L 50/64 (2019.02); B60L 58/26 (2019.02); H01M 10/425 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6554 (2015.04); H01M 10/6556 (2015.04); H01M 10/667 (2015.04); H01M 50/20 (2021.01); H01M 50/209 (2021.01); H01M 50/211 (2021.01); H01M 50/213 (2021.01); H01M 50/284 (2021.01); H01M 2220/20 (2013.01);
Abstract

A method for producing a mechanical and thermal system for a modular battery. The system has a module, which involves a module housing of the module being connected, on a thermally conductive module side, to a cooling apparatus. The module includes an energy storage unit and a power electronics unit, arranged on a circuit board, which are thermally isolated from each other by a first and a second thermally conductive element, which dissipates heat to the module side thermally connected to the cooling apparatus, and are integrated in the module housing, by virtue of the energy storage unit being connected to the first thermally conductive element, which contacts the module side connected to the cooling apparatus, and by virtue of the circuit board and the energy storage unit having the second thermally conductive element arranged between them, which second thermally conductive element contacts the module side connected to the cooling apparatus.


Find Patent Forward Citations

Loading…