The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Oct. 19, 2023
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Takeshi Tamura, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); G02F 1/13357 (2006.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); G02F 1/133603 (2013.01); G02F 1/133611 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); G02F 1/133606 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.


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