The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jul. 05, 2021
Applicant:

Skiileux Electricity Inc., Taoyuan, TW;

Inventor:

Chien-Shou Liao, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An LED package structure and a method of manufacturing the same, and an LED display are provided. The method of manufacturing the LED package structure includes: providing a plurality of LED chips, each of the LED chips having two exposed conductive pads; forming a plurality of quantum dot material layers for respectively enclosing the LED chips; and respectively forming a plurality of blue light scattering material layers on the quantum dot material layers. The LED package structure includes the LED chip that has the two exposed conductive pads, the quantum dot material layer for enclosing the LED chip, and the blue light scattering material layer that is disposed on the quantum dot material layer.


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