The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Dec. 24, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yoshihiko Yano, Tokyo, JP;

Daiki Ishii, Tokyo, JP;

Kenichi Yoshida, Tokyo, JP;

Yuki Yamashita, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 2/06 (2006.01); H01G 4/005 (2006.01); H01G 4/01 (2006.01); H01G 4/012 (2006.01); H01G 4/06 (2006.01); H01G 4/10 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/252 (2006.01); H01G 4/33 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 28/75 (2013.01); H01G 2/065 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); H01G 4/01 (2013.01); H01G 4/012 (2013.01); H01G 4/06 (2013.01); H01G 4/10 (2013.01); H01G 4/1209 (2013.01); H01G 4/1218 (2013.01); H01G 4/1254 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 25/16 (2013.01); H01L 28/84 (2013.01); H05K 1/18 (2013.01); H01G 4/252 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19103 (2013.01); H05K 2201/10015 (2013.01);
Abstract

To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.


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