The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jul. 23, 2021
Applicants:

Beihai Hkc Optoelectronics Technology Co., Ltd., Beihai, CN;

Hkc Corporation Limited, Shenzhen, CN;

Inventors:

Yuming Xia, Shenzhen, CN;

En-Tsung Cho, Shenzhen, CN;

Lidan Ye, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1292 (2013.01); H01L 27/124 (2013.01); H01L 27/1259 (2013.01); H01L 21/2885 (2013.01);
Abstract

A method for manufacturing a data line includes: forming a conductive layer on a substrate; forming a photoresist layer on a side of the conductive layer away from the substrate; exposing and then developing the photoresist layer to form a groove penetrating the photoresist layer, thus obtaining a patterned photoresist layer; and depositing a functional material electrochemically on the patterned photoresist layer, then removing the patterned photoresist layer to obtain the conductive layer with the patterned functional material layer, thereby obtaining the data line.


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