The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Oct. 19, 2020
Texas Instruments Incorporated, Dallas, TX (US);
James Raymond Maliclic Baello, Pampanga, PH;
Steffany Ann Lacierda Moreno, Tarlac, PH;
Jose Carlos Arroyo, Allen, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A semiconductor device assembly includes a package substrate having a top side including a plurality of bondable features, at least one integrated circuit (IC) die including a substrate having at least a semiconductor surface including circuitry configured for realizing at least one function including nodes coupled to bond pads with metal posts on the bond pads. The metal posts are attached by a solder joint to the bondable features. The solder joint has a void density of less than or equal to (≥) 5% of a cross-sectional area of the solder joint.