Metal-coated, polymer-encapsulated electronics modules and methods for making the same

Abstract

Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.