The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Sep. 23, 2021
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Toru Yamada, Kawasaki, JP;
Takafumi Yamada, Kawasaki, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/528 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 23/142 (2013.01); H01L 23/5283 (2013.01); H01L 23/585 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/33181 (2013.01);
Abstract
A semiconductor module includes a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, and a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material. The first bonding portion has a plurality of first protrusions at the bonding surface. Each first protrusion protrudes toward the semiconductor device, and is provided in a position away from the gate runner by a first distance in a plan view of the semiconductor module.