The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Apr. 25, 2022
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/46 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/565 (2013.01); H01L 23/46 (2013.01); H01L 23/585 (2013.01);
Abstract
A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.