The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Dec. 24, 2019
Applicant:
Sansha Electric Manufacturing Co., Ltd., Osaka, JP;
Inventors:
Shohei Maeda, Osaka, JP;
Yoichi Makimoto, Osaka, JP;
Assignee:
SANSHA ELECTRIC MANUFACTURING CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H02M 7/003 (2013.01);
Abstract
A semiconductor module includes a case accommodating a semiconductor element inside and being entirely molded by a resin, a first terminal placed on a top portion of the case and being a terminal to which a bus bar being a flat and elongated metal conductor is to be attached, a second terminal provided on the top portion of the case and being adjacent to the first terminal, and a rib provided between the first terminal and the second terminal. The rib includes a protrusion protruding toward the bus bar.